Dielectric Damage-Free Dual Damascene Cu Interconnects Without Barrier at Via Bottom

ABSTRACT

Techniques for dielectric damage-free interconnects are provided. In one aspect, a method for forming a Cu interconnect structure includes: forming a via and trench in a dielectric over a metal line M1; depositing a first barrier layer into the via and trench; removing the first barrier layer from the via and trench bottoms using neutral beam oxidation, and removing oxidized portions of the first barrier layer such that the first barrier layer remains along only sidewalls of the via and trench; depositing Cu into the via in direct contact with the metal line M1 to form a via V1; lining the trench with a second barrier layer; and depositing Cu into the trench to form a metal line M2. The second barrier layer can instead include Mn or optionally CuMn so as to further serve as a seed layer. A Cu interconnect structure is also provided.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No. 16/163,256filed on Oct. 17, 2018, the contents of which are incorporated byreference herein.

FIELD OF THE INVENTION

The present invention relates to interconnect technology, and moreparticularly, to techniques for dielectric damage-free dual damasceneinterconnects without a barrier layer present at via bottom.

BACKGROUND OF THE INVENTION

Back end of line (BEOL) interconnects are typically created using a dualdamascene process that involves patterning trenches and vias in adielectric and then filling these features with a conductor such ascopper (Cu). A barrier layer (e.g., tantalum nitride (TaN)) is oftenemployed lining the trenches/vias to prevent Cu diffusion into thedielectric.

However, having a via structure without TaN at the via bottom (or withlarge contact area at the via bottom) is desirable to reduce viaresistance and improve electromigration (EM) performance. However, abarrier etch-back (gouging) process (using for example argon (Ar+)etching in physical vapor deposition (PVD) chamber) causes severe low-κdamage at the trench bottom which leads to an increase in capacitanceand reliability degradation.

Alternatively, a conventional wet etching (gouging) process can beemployed to increase contact area at the via bottom. However, due to theisotropic nature of a wet etching process, under-cut (lateral etching)of the dielectric occurs, resulting in under-cut areas that aredifficult to fill by Cu plating since a seed layer cannot be depositedaround under-cut area.

Thus, improved techniques for forming Cu interconnects without a barrierlayer at the via bottom would be desirable.

SUMMARY OF THE INVENTION

The present invention provides techniques for dielectric damage-freedual damascene interconnects without a barrier layer present at viabottom. In one aspect of the invention, a method for forming a copper(Cu) interconnect structure is provided. The method includes: forming avia and a trench in a dielectric over a metal line M1; depositing afirst barrier layer into, and lining, the via and the trench; removingthe first barrier layer from a bottom of the via and a bottom of thetrench by selectively oxidizing portions of the first barrier layeralong the bottom of the via and the bottom of the trench using neutralbeam oxidation that does not damage the dielectric, and removing theportions of the first barrier layer that have been oxidized including atthe bottom of the via such that the first barrier layer remains alongonly sidewalls of the via and the trench; depositing Cu into the via indirect contact with the metal line M1 to form a via V1; at leastpartially removing the first barrier layer that remains along thesidewalls of the trench; lining the trench with a second barrier layerthat covers a top of the via V1; and depositing Cu into the trench overthe second barrier layer to form a metal line M2.

In another aspect of the invention, another method for forming a Cuinterconnect structure is provided. The method includes: forming a viaand a trench in a dielectric over a metal line M1; depositing a firstbarrier layer into, and lining, the via and the trench; removing thefirst barrier layer from a bottom of the via and a bottom of the trenchby selectively oxidizing portions of the barrier layer along the bottomof the via and the bottom of the trench using neutral beam oxidationthat does not damage the dielectric, and removing the portions of thefirst barrier layer that have been oxidized including at the bottom ofthe via such that the first barrier layer remains along only sidewallsof the via and the trench; depositing a liner including manganese (Mn)into the via and the trench over the first barrier layer that remainsalong sidewalls of the via and the trench, wherein the liner is disposeddirectly on the dielectric at the bottom of the trench; annealing theliner to react the Mn in the liner with the dielectric to form a secondbarrier layer including manganese silicate (MnSixOy) at the bottom ofthe trench; removing unreacted portions of the liner including theunreacted portions of the liner at the bottom of the via; and depositingCu into the via and the trench over the second barrier layer to form i)a via V1 in the via that is in direct contact with the metal line M1 andii) a metal line M2 in the trench.

In yet another aspect of the invention, yet another method for forming aCu interconnect structure is provided. The method includes: forming avia and a trench in a dielectric over a metal line M1; depositing afirst barrier layer into, and lining, the via and the trench; removingthe first barrier layer from a bottom of the via and a bottom of thetrench by selectively oxidizing portions of the barrier layer along thebottom of the via and the bottom of the trench using neutral beamoxidation that does not damage the dielectric, and removing the portionsof the first barrier layer that have been oxidized including at thebottom of the via such that the first barrier layer remains along onlysidewalls of the via and the trench; depositing a liner including CuMninto the via and the trench over the first barrier layer that remainsalong sidewalls of the via and the trench, wherein the liner is disposeddirectly on the dielectric at the bottom of the trench, and wherein theliner serves as a seed layer; depositing Cu into the via and the trenchover the liner to form i) a via V1 in the via that is in direct contactwith the metal line M1 and ii) a metal line M2 in the trench; andannealing the liner and the Cu to react the Mn in the liner with thedielectric to form a second barrier layer including MnSixOy at thebottom of the trench.

In still yet another aspect of the invention, a Cu interconnectstructure is provided. The Cu interconnect structure includes: a via anda trench formed in a dielectric over a metal line M1; a first barrierlayer disposed along sidewalls of the via; a second dielectric layerdisposed along a bottom of the trench; and Cu disposed i) in the viaforming a via V1 and ii) in the trench forming a metal line M2, whereinthe Cu disposed in the via is in direct contact with the metal line M1.

A more complete understanding of the present invention, as well asfurther features and advantages of the present invention, will beobtained by reference to the following detailed description anddrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional diagram illustrating a Cu interconnectstructure according to an embodiment of the present invention;

FIG. 2 is a cross-sectional diagram illustrating a trench having beenpatterned in a dielectric D1, and a conformal barrier layer having beendeposited into/lining the trench according to an embodiment of thepresent invention;

FIG. 3 is a cross-sectional diagram illustrating a conductor having beendeposited into (and filling) the trench over the barrier layer forming ametal line M1, and a dielectric D2 having been deposited onto thedielectric D1/metal line M1 according to an embodiment of the presentinvention;

FIG. 4 is a cross-sectional diagram illustrating a via and a trenchhaving been patterned in the dielectric D1, and a (first) barrier layerhaving been deposited into/lining the via and trench according to anembodiment of the present invention;

FIG. 5 is a cross-sectional diagram illustrating neutral beam oxidationhaving been used to selectively oxidize horizontal portions of the firstbarrier layer forming oxidized portions of the barrier layer along thesehorizontal surfaces according to an embodiment of the present invention;

FIG. 6 is a cross-sectional diagram illustrating the oxidized portionsof the first barrier layer having been selectively removed according toan embodiment of the present invention;

FIG. 7 is a cross-sectional diagram illustrating a conductor having beendeposited into (and filling) the via, forming a via V1 according to anembodiment of the present invention;

FIG. 8 is a cross-sectional diagram illustrating an etch having beenused to at least partially strip the remaining portions of the firstbarrier layer from the trench according to an embodiment of the presentinvention;

FIG. 9 is a cross-sectional diagram illustrating the trench having beenlined with a second barrier layer according to an embodiment of thepresent invention;

FIG. 10 is a cross-sectional diagram illustrating a seed layer havingbeen deposited into the trench onto the second barrier layer accordingto an embodiment of the present invention;

FIG. 11 is a cross-sectional diagram illustrating a conductor (e.g., Cu)having been deposited into (and filling) the trench, forming a metalline M2 according to an embodiment of the present invention;

FIG. 12 is a cross-sectional diagram illustrating, according to analternative embodiment which follows from FIG. 6, a liner (e.g., Mn)having been deposited into/lining the via and trench according to anembodiment of the present invention;

FIG. 13 is a cross-sectional diagram illustrating an anneal of the linerhaving been performed to react the liner with exposed dielectric forminga second barrier layer (e.g., MnSixOy) at a bottom of the trenchaccording to an embodiment of the present invention;

FIG. 14 is a cross-sectional diagram illustrating unreacted portions ofthe liner having been removed selective to the reacted portions of theliner according to an embodiment of the present invention;

FIG. 15 is a cross-sectional diagram illustrating a seed layer havingbeen deposited into the via and trench according to an embodiment of thepresent invention;

FIG. 16 is a cross-sectional diagram illustrating a conductor (e.g., Cu)having been deposited into (and filling) the via and trench, forming avia V1 and a metal line M2 according to an embodiment of the presentinvention;

FIG. 17 is a cross-sectional diagram illustrating, according to analternative embodiment which follows from FIG. 6, a conformal liner andseed layer (e.g., CuMn) having been deposited into/lining the via andtrench according to an embodiment of the present invention;

FIG. 18 is a cross-sectional diagram illustrating a conductor (e.g., Cu)having been deposited into (and filling) the via and trench, forming avia V1 and a metal line M2, and an anneal of the liner/conductor havingbeen performed to react the liner with the exposed dielectric forming asecond barrier layer (e.g., MnSixOy) at a bottom of the trench accordingto an embodiment of the present invention; and

FIG. 19 is a cross-sectional diagram illustrating the Cu overburdenhaving been removed according to an embodiment of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Provided herein are techniques for dielectric damage-free dual damasceneinterconnects without a barrier layer present at the via bottom whichadvantageously leads to lower via resistance and high copper (Cu) fillquality. See, for example, FIG. 1 which is a cross-sectional diagramillustrating some of the advantageous features of the presenttechniques.

As shown in FIG. 1, the present dual damascene interconnect structureincludes a metal line and via (i.e., metal line M2 and via V1,respectively, in this example) formed on a first metal line M1. Themetal line M1 and via V1/metal line M2 are present in dielectric layersD1 and D2, respectively.

Namely, as shown in FIG. 1, metal line M1 is present in dielectric D1.Metal line M1 (e.g., Cu) is separated from the dielectric D1 by abarrier layer 104. The interconnect, i.e., via V1 and metal line M2 arepresent in dielectric D2. According to an exemplary embodiment,dielectric D2 includes a capping layer 106 and an interlayer dielectric(ILD) 108. The term “barrier layer” as used herein refers to a layer (orlayers) that prevents diffusion of Cu into the surrounding dielectric.

A barrier layer 110 is present lining the metal line M2 and sidewalls ofthe via V1, however the barrier layer 110 is absent at the bottom of thevia V 1. As noted in FIG. 1, the absence of the barrier layer 110 at thebottom of the via V1 enables direct Cu-to-Cu contact (between the via V1and the metal line M1) which provides low via resistance (as compared toconventional processes having a barrier layer in between the via bottomand the underlying metal line).

As will be described in detail below, the present techniques employneutral beam oxidation to remove the barrier layer from the bottom ofthe via. Neutral beam oxidation advantageously avoids the severedielectric damage resulting from conventional etch-back processes likeargon etching and the lateral etching (undercutting) that occurs withconventional wet etching processes. As highlighted above, dielectricdamage undesirably leads to an increase in capacitance and reliabilitydegradation, while undercutting at the bottom of the via makes itdifficult to get a good quality Cu fill and oftentimes leads to voidformation. These drawbacks are avoided altogether with the presenttechniques.

As shown in FIG. 1, embodiments are provided herein where the barrierlayer, while absent from the bottom of the via V1, is present at the topof the via V1. This configuration exhibits blocking boundary effects dueto having the barrier layer at the top of the via V1 which prevents Cumigration and guarantees short length effects.

A first exemplary methodology for forming a Cu interconnect structure inaccordance with the present techniques is now described by way ofreference to FIGS. 2-11. As shown in FIG. 2, a trench 201 is patternedin the dielectric D1. Generally, dielectric D1 is any suitable ILDincluding but not limited to low-κ dielectrics such as silicon oxide(SiO₂) and/or ultralow-κ (ULK) dielectrics (ULK-ILD), e.g., having adielectric constant κ of less than 2.7. By comparison, silicon dioxide(SiO₂) has a dielectric constant κ value of 3.9. Suitable ultralow-xdielectric materials include, but are not limited to, porousorganosilicate glass (pSiCOH). Standard lithography and etchingtechniques can be employed to pattern trench 201 in the dielectric D1.

A conformal barrier layer 202 is then deposited into/lining the trench201. Suitable materials for the barrier layer 202 include, but are notlimited to, tantalum nitride (TaN), titanium nitride (TiN), tungstennitride (WN), tantalum (Ta) and/or titanium (Ti). A conformal depositionprocess such as chemical vapor deposition (CVD), atomic layer deposition(ALD) or physical vapor deposition (PVD) can be employed to deposit thebarrier layer 102. According to an exemplary embodiment, barrier layer202 has a thickness of from about 2 nanometers (nm) to about 10 nm andranges therebetween.

Next, as shown in FIG. 3, a conductor 301 is then deposited into (andfilling) the trench 201 over the barrier layer 202, forming metal lineM1. According to an exemplary embodiment, the conductor 301 is Cu whichis deposited using an electroless plating process. See, for example,Frank E. Stone, “Chapter 13 Electroless Copper In Printed Wiring BoardFabrication,” accessed Aug. 14, 2018 (45 pages), the contents of whichare incorporated by reference as if fully set forth herein. The primarydifference between electroless plating and electroplating is thatelectroless plating does not require external electrical power. However,embodiments are also contemplated herein where standard electroplatingor any other suitable deposition technique or combinations of techniquesare employed.

By way of example only, a Cu-containing seed layer (not shown) is firstdeposited into/lining the trench 201. Cu (i.e., conductor 301) is thenplated onto the seed layer. As shown in FIG. 3, a process such aschemical-mechanical polishing (CMP) is then used to remove the Cuoverburden and provide a planar surface onto which the interconnect isbuilt.

Dielectric D2 is then deposited onto the dielectric D1/metal line M1.The dielectric D2 is also referred to herein as an underlayer (UL) sinceit is the underlying layer in which the interconnect will be formed.According to an exemplary embodiment, dielectric D2 is formed from astack of layers including, for example, a capping layer 302 disposed onthe dielectric D1/metal line M1 and an ILD 304 disposed on the cappinglayer 302.

Suitable materials for the capping layer 302 include, but are notlimited to, dielectrics such as silicon carbon nitride (SiCN), hydrogensilicon carbon nitride (SiCNH) and/or aluminum nitride (AlN). Asprovided above, suitable ILDs include, but are not limited to, low-κdielectrics such as SiO₂ and/or ultralow-κ dielectrics such as pSiCOH.

Standard lithography and etching techniques are then used to pattern avia 402 and a trench 404 in the dielectric D1. See FIG. 4. As shown inFIG. 4, the via 402 extends through the capping layer 302, down to themetal line M1. A conformal barrier layer 406 is then depositedinto/lining the via 402 and trench 404. As provided above, suitablebarrier layer materials include, but are not limited to, TaN, TiN, WN,Ta and/or Ti. A conformal deposition process such as CVD, ALD or PVD canbe employed to deposit the barrier layer 406. According to an exemplaryembodiment, barrier layer 406 has a thickness of from about 2 nm toabout 10 nm and ranges therebetween.

While barrier layer 406, as deposited, is present at the bottom of thevia V1, this portion of barrier layer 406 will next be removed vianeutral beam oxidation. Namely, as shown in FIG. 5, neutral beamoxidation is employed to selectively oxidize the horizontal portions ofthe barrier layer 406 in via 402 and trench 404, including the(horizontal) portion of barrier layer 406 at the bottom of the via 402.The result is the formation of oxidized portions 502 of the barrierlayer 406 along these horizontal surfaces. See FIG. 5. By way of exampleonly, when the barrier layer 406 is formed from TaN, this neutral beamprocess will oxidize the horizontal portions 502 thereof into tantalumoxynitride (TaOxNy).

For a description of neutral beam oxidation of metal films such asTa-containing films, see Ohno et al., “Neutral Beam Oxidation forOxide-based Nanodevice,” Proceedings of the 16^(th) InternationalConference on Nanotechnology, pgs. 171-173 (August 2016), the contentsof which are incorporated by reference as if fully set forth herein.During this process, the barrier layer is irradiated with a neutraloxygen beam to convert the barrier layer to a metal oxide, which canthen be selectively removed. See, for example, U.S. Pat. No. 8,847,148issued to Kirpatrick et al., entitled “Method and Apparatus for NeutralBeam Processing Based on Gas Cluster Ion Beam Technology,” the contentsof which are incorporated by reference as if fully set forth herein.Advantageously, neutral beam oxidation is a highly selective,directional oxidation process allowing for the selective oxidation ofonly the horizontal portions of the barrier layer 406.

The oxidized portions 502 of the barrier layer 406 are then removed(selective to the unoxidized (vertical) portions 406 a of barrier layer406, which are now given reference numeral 406 a). See FIG. 6. Accordingto an exemplary embodiment, the oxidized portions 502 of the barrierlayer 406 are selectively removed using an isotropic wet etchingprocess. By way of example only, TaOxNy dissolves in hydrofluoric acid(HF), and reacts with potassium bifluoride and HF. See, for example, A.Agulyansky, “Potassium fluorotantalate in solid, dissolved and moltenconditions,” J. Fluorine Chemistry 123, October 2003, pgs. 155-161, thecontents of which are incorporated by reference as if fully set forthherein. Dilute HF, for example, can be used to remove oxidized TiN/Ta/Tiselective to TiN/Ta/Ti. A wet etch chemistry such as dilute peroxide canbe used to oxidized WN selective to WN. It is noted that the steps up tothis point in the process flow are the same for each of the embodimentsdescribed herein. Thus, the description of the alternative embodimentsprovided below will follow from the structure shown in FIG. 6.

Next, as shown in FIG. 7, a conductor 701 is then deposited into (andfilling) the via 402, forming via V1. According to an exemplaryembodiment, the conductor 701 is Cu which is deposited using anelectroless plating process. Advantageously, since the barrier layer 406has been removed from the bottom of the via 402, there is directCu-to-Cu contact between the via V1 and the metal line M1. Portions ofbarrier layer 406 a, however, remain lining the sidewalls of the via V1.

In preparation for forming the metal line M2, the barrier layer needs tobe added back to the trench 404. To do so, it is preferable to at leastpartially remove the remaining portions of barrier layer 406 a from thetrench 404. The reason for this step is that when the barrier layer isadded back to the trench 404 it will end up being too thick along thevertical sidewalls of the trench 404 if simply added on top of theexisting portions 406 a. Thus, as shown in FIG. 8, an etch is used tostrip the remaining portions of barrier layer 406 a from the trench 404.According to an exemplary embodiment, remaining portions of barrierlayer 406 a are selectively removed from the trench 404 using anon-directional (isotropic) etching process such as a nitride-selectivewet etch in the case of TaN. It is notable that the etch does not needto fully remove the portions of barrier layer 406 a as long as they aresubstantially thinned. For instance, the portions of barrier layer 406 aare reduced in thickness by greater than or equal to about 50% of theiroriginal thickness. Thus, for example, if the portions of barrier layer406 a have a starting thickness of about 5 nm (see above), then reducingthe thickness of portions of barrier layer 406 a to about 2.5 nm or lessis sufficient.

The trench is then lined with another conformal barrier layer 902 usinga process such as CVD, ALD or PVD. See FIG. 9. For clarity, the terms“first” and “second” may be used herein when referring to barrier layers406 and 902, respectively. As provided above, suitable materials for thebarrier layer include, but are not limited to, TaN, TiN, WN, Ta and/orTi. By way of example only, the same material(s) can be used for barrierlayer 902 as barrier layer 406. However, this is not a requirement, anda different material(s) from barrier layer 406 can be employed if sodesired. According to an exemplary embodiment, barrier layer 902 has athickness of from about 2 nm to about 10 nm and ranges therebetween.

A thin, conformal seed layer 1002 is then deposited into the trench 404onto the barrier layer 902 which will enable, e.g., electroless plating,to be used in forming the metal line M2 in trench 404. See FIG. 10.Suitable materials for the seed layer 1002 include, but are not limitedto, Cu. A conformal deposition process such as CVD, ALD or PVD can beemployed to deposit the seed layer 1002. According to an exemplaryembodiment, the seed layer 1002 has a thickness of from about 5 nm toabout 20 nm and ranges therebetween.

Next, as shown in FIG. 11, a conductor 1101 is then deposited into (andfilling) the trench 404, forming metal line M2. It is notable that, oncethe M2 metal line is formed, the seed layer 1002 is no longerdistinguishable from the conductor 1101, and thus the seed layer 1002 isno longer shown as a distinct layer in the figures. According to anexemplary embodiment, the conductor 1101 is Cu which is deposited usingan electroplating or electroless plating process. Advantageously, thebarrier layer 902 remains at the top of the via V1 which, as providedabove, exhibits blocking boundary effects.

In a variation of this embodiment, another exemplary methodology forforming a Cu interconnect structure in accordance with the presenttechniques is now described by way of reference to FIGS. 12-16 whereby adifferent barrier layer material (e.g., manganese silicate (MnSixOy)) isadded back to the bottom of the trench 404 such that the sidewalls ofthe via 402 and trench 404 are lined with one barrier layer material andthe bottom of the trench is lined with another, different barrier layermaterial.

As highlighted above, the initial steps for this alternative embodimentare the same as those described in conjunction with the description ofFIGS. 1-6, above. Thus, FIG. 12 follows from the structure depicted inFIG. 6 and described above.

Following from FIG. 6, as shown in FIG. 12 in this alternativeembodiment a conformal liner 1202 is deposited into/lining the via 402and trench 404. A process such as CVD, ALD or PVD can be used to depositthe liner 1202 into the via 402 and trench 404. According to anexemplary embodiment, the liner 1202 is formed from manganese (Mn) andhas a thickness of from about 5 nm to about 20 nm and rangestherebetween. In yet another alternative embodiment (described below),the liner additionally contains Cu enabling it to further serve as aseed layer.

It is notable that, based on the above described process whereby thebarrier layer 406 is selectively removed (via neutral beam oxidation)from the horizontal surfaces including the bottom of the via 402 and thebottom of the trench 404, the ILD 304 is now exposed at the bottom ofthe trench 404. Thus, the liner 1202 is disposed i) directly on the ILD304 at the bottom of the trench 404 and ii) on the remaining portions ofbarrier layer 406 a along the sidewalls of the via 402 and trench 404.

An anneal of the liner 1202 is then performed to react the liner 1202with the exposed ILD 304. As provided above, the liner 1202 can beformed from Mn. In that case, portions 1202 a of the liner 1202 incontact with the exposed ILD 304 at the bottom of the trench 404 willselectively be converted to MnSixOy, while portions 1202 b of the liner1202 remain unreacted Mn. Notably, the portions 1202 b of liner 1202 atthe bottom of the via 402 are present directly on the metal line M1 andremain unreacted Mn. See FIG. 13. According to an exemplary embodiment,the anneal is performed at a temperature of from about 100° C. to about400° C. and ranges therebetween, for a duration of from about 30 minutesto about 120 minutes and ranges therebetween.

The unreacted portions 1202 b of the liner 1202 are then removedselective to the reacted portions 1202 a of the liner 1202. See FIG. 14.As shown in FIG. 14, what remains are the reacted portions 1202 a of theliner 1202 (e.g., MnSixOy) disposed on the ILD 304 at the bottom of thetrench 404. According to an exemplary embodiment, the unreacted portions1202 b of the liner 1202 are selectively removed using deionized (DI)water. The reacted portions 1202 a of the liner 1202 (e.g., MnSixOy)will serve as a barrier layer at the bottom of the trench 404. Thus, forclarity, the terms “first barrier layer” and “second barrier layer” maybe used herein when referring to barrier layer 406 and portions 1202 aof the liner 1202 (e.g., MnSixOy), respectively.

A thin, conformal seed layer 1502 is then deposited into the via 402 andtrench 404 which will enable, e.g., electroless plating, to be used informing the metal line M2 in trench 404. See FIG. 15. As shown in FIG.15, the seed layer 1502 is present on the portions of barrier layer 406a along the sidewalls of the via 402 and trench 404, on the reactedportions 1202 a of the liner 1202 (e.g., MnSixOy) at the bottom of thetrench 404 and on the metal line M1 at the bottom of the via 402.

As provided above, suitable materials for the seed layer 1502 include,but are not limited to, Cu. A conformal deposition process such as CVD,ALD or PVD can be employed to deposit the seed layer 1502. According toan exemplary embodiment, the seed layer 1502 has a thickness of fromabout 5 nm to about 20 nm and ranges therebetween.

Next, as shown in FIG. 16, a conductor 1601 is then deposited into (andfilling) the via 402 and trench 404, forming via V1 and metal line M2,respectively. It is notable that, once the via V1 and M2 metal line areformed, the seed layer 1502 is no longer distinguishable from theconductor 1601, and thus the seed layer 1502 is no longer shown as adistinct layer in the figures. According to an exemplary embodiment, theconductor 1601 is Cu which is deposited using an electroless platingprocess.

As highlighted above, a variant of this process involves employing aliner that also serves as a seed layer, eliminating the additional stepof depositing a separate seed layer prior to plating. This alternativeexemplary methodology for forming a Cu interconnect structure inaccordance with the present techniques is now described by way ofreference to FIGS. 17-19. As highlighted above, the initial steps forthis alternative embodiment are the same as those described inconjunction with the description of FIGS. 1-6, above. Thus, FIG. 17follows from the structure depicted in FIG. 6 and described above.

Following from FIG. 6, as shown in FIG. 17 in this alternativeembodiment a conformal liner 1702 is deposited into/lining the via 402and trench 404. A process such as CVD, ALD or PVD can be used to depositthe liner 1702 into the via 402 and trench 404. According to anexemplary embodiment, the liner 1702 is formed from Cu—Mn alloy and hasa thickness of from about 5 nm to about 20 nm and ranges therebetween.

With the liner 1702 in place and serving as a seed layer, as shown inFIG. 18, a conductor 1801 is then deposited into (and filling) the via402 and trench 404, forming via V1 and metal line M2, respectively.According to an exemplary embodiment, the conductor 1801 is Cu which isdeposited using an electroless plating process.

Following Cu plating, an anneal of the liner 1702/conductor 1801 is thenperformed to react the liner 1702 with the exposed ILD 304. As providedabove, the liner 1702 can contain Mn. In that case, (reacted) portions1702′ of the liner 1702 in contact with the exposed ILD 304 at thebottom of the trench 404 will selectively be converted to MnSixOy. Thereacted portions 1702′ of the liner 1702 (e.g., MnSixOy) will serve as abarrier layer at the bottom of the trench 404. Thus, for clarity, theterms “first barrier layer” and “second barrier layer” may be usedherein when referring to barrier layer 406 and portions 1702′ of theliner 1702 (e.g., MnSixOy), respectively.

According to an exemplary embodiment, the anneal is performed at atemperature of from about 100° C. to about 400° C. and rangestherebetween, for a duration of from about 30 minutes to about 120minutes and ranges therebetween. Notably, the unreacted (e.g., Mn) liner1702 (i.e., those portions of the liner 1702 disposed on the portions406 a of the barrier layer along the sidewalls of the via 402 and trench404 and on the metal line M1 at the bottom of the via 402) migrate, viathe anneal, through the conductor 1801 to the overburden at the top ofthe structure, and will be removed via CMP—see below. See FIG. 18. Thus,only the reacted portions 1702′ of the liner 1702 remain visible in thefigures.

As shown in FIG. 19, the overburden is then removed. According to anexemplary embodiment, the overburden is removed using a process such aschemical-mechanical polishing (CMP) to polish the conductor 1801.

Although illustrative embodiments of the present invention have beendescribed herein, it is to be understood that the invention is notlimited to those precise embodiments, and that various other changes andmodifications may be made by one skilled in the art without departingfrom the scope of the invention.

What is claimed is:
 1. A method for forming a copper (Cu) interconnectstructure, the method comprising the steps of: forming a via and atrench in a dielectric over a metal line M1; depositing a first barrierlayer into, and lining, the via and the trench; removing the firstbarrier layer from a bottom of the via and a bottom of the trench byselectively oxidizing portions of the barrier layer along the bottom ofthe via and the bottom of the trench using neutral beam oxidation thatdoes not damage the dielectric, and removing the portions of the firstbarrier layer that have been oxidized including at the bottom of the viasuch that the first barrier layer remains along only sidewalls of thevia and the trench; depositing a liner comprising manganese (Mn) intothe via and the trench over the first barrier layer that remains alongsidewalls of the via and the trench, wherein the liner is disposeddirectly on the dielectric at the bottom of the trench; annealing theliner to react the Mn in the liner with the dielectric to form a secondbarrier layer comprising manganese silicate (MnSixOy) at the bottom ofthe trench; removing unreacted portions of the liner including theunreacted portions of the liner at the bottom of the via; and depositingCu into the via and the trench over the second barrier layer to form i)a via V1 in the via that is in direct contact with the metal line M1 andii) a metal line M2 in the trench.
 2. The method of claim 1, wherein thefirst barrier layer comprises a material selected from the groupconsisting of: tantalum nitride (TaN), titanium nitride (TiN), tungstennitride (WN), titanium (Ti), tantalum (Ta) and combinations thereof. 3.The method of claim 1, wherein the Cu is deposited into the via and thetrench using electroless Cu plating, the method further comprising thestep of: depositing a Cu seed layer onto the first barrier layer alongsidewalls of the via and the trench and onto the second barrier layer atthe bottom of the trench.
 4. The method of claim 1, wherein theannealing is performed at a temperature of from about 100° C. to about400° C. and ranges therebetween, for a duration of from about 30 minutesto about 120 minutes and ranges therebetween.
 5. A method for forming aCu interconnect structure, the method comprising the steps of: forming avia and a trench in a dielectric over a metal line M1; depositing afirst barrier layer into, and lining, the via and the trench; removingthe first barrier layer from a bottom of the via and a bottom of thetrench by selectively oxidizing portions of the barrier layer along thebottom of the via and the bottom of the trench using neutral beamoxidation that does not damage the dielectric, and removing the portionsof the first barrier layer that have been oxidized including at thebottom of the via such that the first barrier layer remains along onlysidewalls of the via and the trench; depositing a liner comprising CuMninto the via and the trench over the first barrier layer that remainsalong sidewalls of the via and the trench, wherein the liner is disposeddirectly on the dielectric at the bottom of the trench, and wherein theliner serves as a seed layer; depositing Cu into the via and the trenchover the liner to form i) a via V1 in the via that is in direct contactwith the metal line M1 and ii) a metal line M2 in the trench; andannealing the liner and the Cu to react the Mn in the liner with thedielectric to form a second barrier layer comprising MnSixOy at thebottom of the trench.
 6. The method of claim 5, wherein the firstbarrier layer comprises a material selected from the group consistingof: TaN, TiN, WN, Ti, Ta and combinations thereof.
 7. The method ofclaim 5, wherein the Cu is deposited into the via and the trench usingelectroless Cu plating.
 8. The method of claim 5, wherein the annealingis performed at a temperature of from about 100° C. to about 400° C. andranges therebetween, for a duration of from about 30 minutes to about120 minutes and ranges therebetween.
 9. The method of claim 5, furthercomprising the step of: polishing the Cu to remove overburden.
 10. A Cuinterconnect structure, comprising: a via and a trench formed in adielectric over a metal line M1; a first barrier layer disposed alongsidewalls of the via; a second barrier layer disposed along a bottom ofthe trench; and Cu disposed i) in the via forming a via V1 and ii) inthe trench forming a metal line M2, wherein the Cu disposed in the viais in direct contact with the metal line M1.
 11. The Cu interconnectstructure of claim 10, wherein the first barrier layer comprises amaterial selected from the group consisting of: TaN, TiN, Ti, Ta andcombinations thereof, and wherein the first barrier layer is disposedalong sidewalls of the trench.
 12. The Cu interconnect structure ofclaim 10, wherein the second barrier layer comprises MnSixOy.
 13. The Cuinterconnect structure of claim 10, wherein the first barrier layer andthe second barrier layer each comprises a material selected from thegroup consisting of: TaN, TiN, WN, Ti, Ta and combinations thereof. 14.The Cu interconnect structure of claim 13, wherein the first barrierlayer comprises a same material as the second barrier layer.
 15. The Cuinterconnect structure of claim 10, wherein the second barrier layer isdisposed along sidewalls of the trench and covers a top of the via V1.16. The Cu interconnect structure of claim 10, wherein the dielectriccomprises: a capping layer on the metal line M1; and an interlayerdielectric (ILD) on the capping layer.
 17. The Cu interconnect structureof claim 16, wherein the capping layer comprises a material selectedfrom the group consisting of: silicon carbon nitride (SiCN), hydrogensilicon carbon nitride (SiCNH), aluminum nitride (AlN) and combinationsthereof.
 18. The Cu interconnect structure of claim 16, wherein the ILDcomprises a material selected from the group consisting of: siliconoxide (SiO₂), porous organosilicate glass (pSiCOH), and combinationsthereof.
 19. The Cu interconnect structure of claim 10, wherein thefirst barrier layer and the second barrier layer each has a thickness offrom about 2 nm to about 10 nm and ranges therebetween.
 20. The Cuinterconnect structure of claim 10, wherein the metal line M1 comprisesCu.